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Dross s impact on the process Dross is solder lost from the manufacturing process. Economics of dross In high-volume manufacturing, the amount of solder lost to dross can mean hundreds of dollars of lost solder per week per machine. Of course, the actual cost depends on machine use, solder alloy, and quantity of boards soldered. However, the dross can be returned to some solder founders for recycling. Sn drift Excessive dross on the surface of the solder can disrupt normal wave dynamics. In the case of Sn/Pb solder, Sn oxidizes more easily than Pb. The solder can become Sn depleted over the long term. This is known as Sn drift. The same is true of Sn-based Pb-free solder alloys, but since some alloys are nearly all Sn (SAC305 with 96.5 percent Sn by weight), this effect will be less dramatic. However, other Pb-free alloy perturbations such as dissolution of Cu become much more important. For example, in the case of the eutectic Sn-Cu alloy, the copper content is only 0.7 wt percent. Small changes in the copper content by means of copper dissolution of copper pads on the board can have a dramatic effect on the melting temperature of the solder.

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Jan 19, 2016 · Convert Tiff file into PDF file using iTextSharp DLL. iTextSharp.text.pdf.PdfWriter writer = iTextSharp.text.pdf.PdfWriter.GetInstance(document, new System.IO.FileStream(destPdf, System.IO.FileMode.Create)); System.Drawing.Bitmap bmp = new System.Drawing.Bitmap(sourceTif); iTextSharp.text.pdf.PdfContentByte cb = writer ...
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47.4.7.1.1 Dross-Related Process Defects. Dross can generally change the dynamics at the wave-land-lead interface, discouraging adequate pull-back of the solder and encouraging defects. Molten solder droplets can become entrapped in the dross as a result of wave turbulence and mixing of the oxides with the molten solder. Once oxidized, they are unable to rejoin solder in the reservoir. As the dross passes through a PTH pin field intended for soldering, it is raked by the pins; the pins acting as a strainer. The dross containing liquid solder can hang up on the pins and cause shorting (an effect known as drossy shorts). This drossthickened layer can also block the solder wave from effectively contacting PWB land and component lead, and opens (skips) result. 47.4.7.1.2 Taming Dross. Various schemes have been devised to control dross, such as co-mixing the pumped solder with a mineral oil, which floats to the surface, blanketing the solder from the atmosphere. Liquid reducing agents can be added to the solder as well as fluxes. In the long term, none of these has proven popular. The most popular method of dealing with dross is manually scooping dross from the surface of the solder reservoir with a ladle. Machines that vacuum dross are also available. Inerting is effective in reducing dross formation and ensuring best fluxing from no-clean or other weakly activated fluxes. Nitrogen as a cover gas has become the most effective method

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As IPC specifications are regularly reviewed and updated, it is recommended that the latest IPC specification be used for actual applications. However, an example of a laminate designation in IPC-4101 is:

L Material Designator 25 Specification Sheet Number 1500 Nominal Laminate Thickness C1/C1 Metal Cladding Type and Nominal Weight/Thickness A Thickness Tolerance Class A Surface Quality Class

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Material designator L refers to laminate. Specification sheet number This designation references the specification sheet number as in Table 6.2. Nominal laminate thickness Four digits identify this variable. It may be specified either over the cladding or over the dielectric. For metric specification, the first digit represents whole millimeters, the second represents tenths of millimeters, and so on. For orders requiring English units, the four digits indicate the thickness in ten-thousandths of an inch (tenths of mils). In the example shown, 1500 is designated for the English usage of 0590.

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TABLE 6.3 Metal Cladding Types Summarized in IPC-4101 (IPC-CF-148, IPC-4562, and IPC-CF-152 are Actual Metal Cladding Specifications)2 Designation A B C D G H J K L M N O P R S T U V X Y Z Metal Cladding Type Copper, wrought, rolled (IPC-4562, grade 5) Copper, rolled (treated) Copper, electrodeposited (IPC-4562, grade 1) Copper, electrodeposited, double treat (IPC-4562, grade 1) Copper, electrodeposited, high ductility (IPC-4562, grade 2) Copper, electrodeposited, high temperature elongation (IPC-4562, grade 3) Copper, electrodeposited, annealed (IPC-4562, grade 4) Copper, wrought, light cold rolled (IPC-4562, grade 6) Copper, wrought, annealed (IPC-4562, grade 7) Copper, wrought, rolled, low temperature annealable (IPC-4562, grade 8) Nickel Unclad Copper, electrodeposited, high temperature elongation, double treat (IPC-4562, grade 3) Copper, reverse treated electrodeposited (IPC-4562, grade 1) Copper, reverse treated electrodeposited, high temperature elongation (IPC-4562, grade 3) Copper, copper foil parameters as dictated by contract or purchase order Aluminum Copper, revers treated electrodeposited, high temperature elongation (IPC-4562, grade 3) for buried capacitance applications As agreed between user and supplier Copper Invar Copper Copper, electrodeposited, high temperature elongation, double-treat (IPC-4562, grade 3) for buried capacitance applications

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